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100 积分 2024-08-01 加入
Jet-enhanced manifold microchannels for cooling electronics up to a heat flux of 3,000 W cm−2
23天前
已完结
Highly efficient bio-inspired manifold microchannel cooling for steady-state and transient thermal management of high-power chips
7个月前
已完结
Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors
8个月前
已完结
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