Lv4
758 积分 2023-12-28 加入
A review of heat removal technologies across heat flux frontiers: From high to ultra high level
2个月前
已完结
Experimental and numerical study on two-phase minichannel cold plate for high-power device
3个月前
已完结
Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid
3个月前
已完结
Jet-enhanced manifold microchannels for cooling electronics up to a heat flux of 3,000 W cm−2
3个月前
已完结
Topology optimization design and verification of the multi-layer manifold microchannel liquid cooled plate structure
3个月前
已完结
Manifold Integrated Cold Plate for Single-Phase and Two-Phase Liquid Cooling
7个月前
已完结
Embedded cooling to meet the 2kW thermal design power of HPC chips in the future
7个月前
已完结
Research progress on structural optimization design of microchannel heat sinks applied to electronic devices
7个月前
已完结
Enhanced single-phase heat transfer performance of glass-based microchannels with a three-dimensional wavy-rectangular structure
7个月前
已关闭
Extremely high heat flux dissipation and hotspots removal with nature-inspired single-phase microchannel heat sink designs
7个月前
已完结
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