Lv613
2890 积分 2025-11-17 加入
Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications
12天前
已完结
Interfacial bonding and fracture mechanism of tempered glass and aluminium alloy direct welding by top-hat nanosecond laser
1个月前
已完结
Welding between rough copper foil and silica glass using green femtosecond laser
2个月前
已完结
Ultrasonic-assisted surface roughening of glass substrate to improve adhesion of electroless nickel seed layer in microsystems packaging
2个月前
已完结
Laser-induced cavitation cleaning of micro–nanoparticles on optical glass: mechanisms and efficiency in aqueous environments
2个月前
已完结
Direct writing and modulating of diverse micro/nanostructures on glass substrate by using femtosecond laser
3个月前
已完结
Effects of cold atmospheric plasma pretreatment of glass substrates on the properties of CdO films deposited by DC pulsed magnetron sputtering
3个月前
已完结
Continuous Electroless Seed Layer Deposition in Through-Glass-Vias by Ultrasonic Agitation
3个月前
已完结
Relationship between bonding strength and surface roughness in low-temperature bonding of glass for micro/nanofluidic device
4个月前
已完结
Cornerstone of Next-Generation 3D Integration: Structures, Processes, and Applications of TGV
4个月前
已完结
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