Lv426
410 积分 2025-11-17 加入
Fabrication of micro holes with high surface quality and integrity by high-speed laser trepanning and electrochemical post-treatment
4天前
已完结
Dynamic synergy of interfacial water driven by a conjugated-polymer leveler for void-free Cu microvia filling
8天前
已关闭
A novel inorganic leveler of sodium azide for high aspect ratio through-holes uniform Cu thickening with high throwing power by electronic plating
14天前
已完结
Unveiling the uniform copper thickening mechanism of micro through-hole using 4,7,10-trioxa-1,13-tridecanediamine as a novel and single additive in an acidic electroplating bath
14天前
已关闭
Unveiling the uniform copper thickening mechanism of micro through-hole using 4,7,10-trioxa-1,13-tridecanediamine as a novel and single additive in an acidic electroplating bath
15天前
已完结
Investigation of a Single-Component Additive for Bottom-Up Superfilling of the High-Aspect-Ratio TSV by Theoretical and Experimental Studies
17天前
已完结
Evaluating copper plating process for filling micro vias with thin surface Cu by 1-(4-carboxyphenyl)-5-mercapto-1H-tetrazole additive
24天前
已完结
Tributyl(hexyl)phosphonium chloride as a new leveler for microvia copper superconformal electronic plating
1个月前
已完结
1-Dodecyl-2-methyl-3-benzylimidazolium chloride as a novel leveler: Towards simultaneously both the microvia viod-free filling and through hole conformal thickenging
1个月前
已完结
Experimental and theoretical study of tetrazolium derivatives as levelers for copper superfilling in microvias
1个月前
已完结
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