Lv69
2530 积分 2025-11-17 加入
Welding between rough copper foil and silica glass using green femtosecond laser
29天前
已完结
Ultrasonic-assisted surface roughening of glass substrate to improve adhesion of electroless nickel seed layer in microsystems packaging
1个月前
已完结
Laser-induced cavitation cleaning of micro–nanoparticles on optical glass: mechanisms and efficiency in aqueous environments
1个月前
已完结
Direct writing and modulating of diverse micro/nanostructures on glass substrate by using femtosecond laser
1个月前
已完结
Effects of cold atmospheric plasma pretreatment of glass substrates on the properties of CdO films deposited by DC pulsed magnetron sputtering
2个月前
已完结
Continuous Electroless Seed Layer Deposition in Through-Glass-Vias by Ultrasonic Agitation
2个月前
已完结
Relationship between bonding strength and surface roughness in low-temperature bonding of glass for micro/nanofluidic device
2个月前
已完结
Cornerstone of Next-Generation 3D Integration: Structures, Processes, and Applications of TGV
2个月前
已完结
Review of glass substrates for co-packaged optics: fabrication and performance of integrated electro-optical structures
3个月前
已完结
In-operando visualization of the dynamic microvia copper filling process for metal interconnection of integrated circuit
3个月前
已关闭
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