Lv11
20 积分 2025-11-21 加入
Panel Warpage and Die Shift Simulation and Characterization of Fan-Out Panel-Level Packaging
16天前
已完结
A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage
16天前
已完结
Finite Element Warpage Simulation and Optimization of Fan-Out Wafer-Level Packaging Based on Equivalent Modeling
16天前
已完结
Design of a X-Band 2×2 Phased-Array Transceiver Module Using Chiplet Method
1个月前
已完结
2023 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 13
1个月前
已完结
W-band antenna in package module with hybrid glass-compound WLFO process
2个月前
已完结
Reliability of Fine-Pitch Cu-Microbumps for 3D Heterogeneous Integration: Effect of Solder, Pitch Scaling and Substrate Materials
2个月前
已完结
Advanced Packaging of 3D Fan-out RF Microsystem for 5G IoT Communication
2个月前
已完结
Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process
2个月前
已完结
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