Lv1
10 积分 2025-11-21 加入
Reduced warpage in semiconductor packages: Optimizing post-cure temperature profile considering cure shrinkage and viscoelasticity of epoxy molding compound
1个月前
已完结
Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage
1个月前
已完结
Panel Warpage and Die Shift Simulation and Characterization of Fan-Out Panel-Level Packaging
2个月前
已完结
A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage
2个月前
已完结
Finite Element Warpage Simulation and Optimization of Fan-Out Wafer-Level Packaging Based on Equivalent Modeling
2个月前
已完结
Design of a X-Band 2×2 Phased-Array Transceiver Module Using Chiplet Method
2个月前
已完结
2023 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 13
3个月前
已完结
W-band antenna in package module with hybrid glass-compound WLFO process
3个月前
已完结
皖公网安备34019202002308
