Lv2
132 积分 2024-06-29 加入
Bonding Strength of Cu Sinter Die-Bonding Paste on Ni, Cu, Ag, and Au Surfaces under Pressureless Bonding Process
24天前
已关闭
Embedding of Power Electronic Components
25天前
已完结
Preparation process for biomass nanofiber/bisphenol A-type epoxy resin composites with superior mechanical and thermal properties
2个月前
已完结
Highly‐Effective Thermoelectric Cooling for Power Semiconductor Devices Packed with Thermal‐Expansion Offset and Flame Retardancy Epoxy Resin
2个月前
已完结
Enhancing thermal conductivity of epoxy-based composites at low temperatures by Si3N4 binary fillers
2个月前
已完结
Development of commercial fully bio-based sport utility using jute/hemp bio-epoxy composite: Influence of stacking sequence on the fatigue, thermo-mechanical, vibrational and viscoelastic behavior
2个月前
已完结
Investigations on the dynamical and thermal stability of basalt/kevlar fibers reinforced porcelain filler particulates epoxy matrix composite
2个月前
已完结
Bio-based epoxy composite: investigating thermal stability, flame resistance, and structural integrity of Coccinia Grandis fibre reinforcements
2个月前
已完结
Mechanical Twinning in Semiconductors
2个月前
已完结
Enhancing thermal mechanical properties of polymer composites with hollow porous fillers
3个月前
已关闭
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