Lv6
2320 积分 2022-07-17 加入
Investigating geometric design parameters in a manifold microchannel cooling system
11小时前
已完结
Experimental investigation of manifold microchannel heat sink structures on flow and heat transfer characteristics
11小时前
已完结
Efficient flow boiling in wedge-shaped manifold microchannels for high heat flux chips cooling
11小时前
已完结
Experimental investigation of heat transfer and pressure drop in copper manifold microchannel heat sinks
11小时前
已完结
Thermal-hydraulic-stress coupling performance and structure optimization of a liquid cold plate heat exchanger applied to data centers
21天前
已完结
Ultra-high-performance cold plate development through topology optimization and electrochemical additive manufacturing
21天前
已完结
Metal additively manufactured wavy fin cold-plate architecture for improved thermal-hydraulic performance
21天前
已完结
Numerical study of distributed jet microchannels with Micro-pin-fins: Structural comparison and temperature uniformity optimization
1个月前
已完结
Thermal management of data centers: Chip-scale cooling using novel distributed inlet–outlet jet impingement liquid cold plate
1个月前
已完结
Electrochemical additive manufacturing-based cold plate with distributed inlet nozzles and outlet slots for high-power-density electronics cooling
1个月前
已完结
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