Lv61
2440 积分 2022-07-17 加入
Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers
6天前
已完结
Flow boiling of HFE-7100 for cooling multi-chip modules using manifold microchannels
6天前
已完结
Highly efficient bio-inspired manifold microchannel cooling for steady-state and transient thermal management of high-power chips
7天前
已完结
Metal additively manufactured wavy fin cold-plate architecture for improved thermal-hydraulic performance
7天前
已完结
Numerical and experimental investigation of TPMS-structured cold plates for electronic device cooling
7天前
已完结
Experimental and numerical investigation of LTCC-based liquid cold plate for high-performance computing processors
7天前
已完结
Scalably etched large footprint copper cold plates for high-power dissipation in data centers using R1233zd(E)
7天前
已完结
Small channel cold plate flow field and bionic rib structure design for high heat flux electronic devices cooling
7天前
已完结
Thermal management of data centers: Chip-scale cooling using novel distributed inlet-outlet jet impingement liquid cold plate
7天前
已完结
A novel double-layer manifold design for uniform cooling of multiple SiC power modules
7天前
已完结
皖公网安备34019202002308
