Lv1
100 积分 2021-09-15 加入
An Improved Evaluation Method for the Short-Circuit Withstand Capability of Press-Pack IGBT Modules
5个月前
已完结
Study on morphology and interface relationship between Ag3(Sn, In) and Cu6(Sn, In)5
1年前
已完结
Morphologies and nucleus models of β-Sn grains in SAC305-xIn freestanding solder balls and solder joints
1年前
已完结
Effects of In addition on microstructure and properties of SAC305 solder
1年前
已完结
Thermodynamic characteristics, microstructure and mechanical properties of Sn-0.7Cu-xIn lead-free solder alloy
1年前
已完结
Effects of Indium Content on Microstructural, Mechanical Properties and Melting Temperature of SAC305 Solder Alloys
1年前
已关闭
The microstructure, melting properties and wettability of Sn–3.5Ag–0.7Cu–xIn lead-free solder alloys
1年前
已完结
Effect of Al and Bi addition on the corrosion behaviour, hardness, and melting temperature of lead-free solder alloys
1年前
已完结
Insight into the improvement of service performance of Sn/Cu solder joint by Pt doping in Cu6Sn5 interfacial intermetallic compound
1年前
已完结
Study on the properties of low silver Sn1.0Ag0.5Cu composite solder reinforced with nickel-plated zinc oxide and its soldering joint
1年前
已完结
以眼部症状为首诊的韦格纳肉芽肿1例
3年前
已采纳
以眼部症状为首诊的韦格纳肉芽肿1例
3年前
已撤回
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