Lv6
1980 积分 2023-10-24 加入
Thermal Characteristics Dependency of Epoxy Underfill on Crosslinker Molecular Structures and Hardener Concentration in Electronic Packaging
1个月前
已完结
Underfill Flow in Flip-Chip Encapsulation Process: A Review
1个月前
已完结
An artificial intelligence enabled chemical synthesis robot for exploration and optimization of nanomaterials
5个月前
已完结
Machine learning to optimize nonlinear conductive performance of composites for self‐adaptive electromagnetic shielding
6个月前
已完结
AI-Driven Design of Multifunctional Polyimides: Revolutionizing the Paradigm from Data to Synthesis
6个月前
已关闭
Optimized design of contact interfaces for enhanced heat dissipation in flip-chip package
7个月前
已完结
Multiscale filler network design enables solid–liquid reversible thermal interface materials with high thermal conductivity and low thermal resistance
7个月前
已完结
Sandwich Structured Heat Dissipation Composite Consisting of Carbon Nanotube/Epoxy Resin and Boron Nitride/Epoxy Resin
7个月前
已关闭
Preparation of highly thermally conductive epoxy resin composites via hollow boron nitride microbeads with segregated structure
7个月前
已完结
Construction of thermal conduction networks and decrease of interfacial thermal resistance for improving thermal conductivity of epoxy natural rubber composites
7个月前
已完结
Understanding N-site substituents effect on corrosion inhibition performance of benzotriazoles derivatives in copper chemical mechanical planarization: Theoretical and experimental analysis
1年前
已采纳
Single-Stage Isolated AC–DC Converter Based on LCL Resonant DAB Converters With Single-Loop Control
1年前
已采纳
95‐2: Ultra‐Small Pixel Color‐Conversion Arrays for MicroLED Displays with Color‐Purification Enhanced Color Gamut
1年前
已采纳
Research note: On relation between photopic luminous efficacy and colour rendering of LED strips
1年前
已采纳
皖公网安备34019202002308
