Lv6
1770 积分 2023-10-24 加入
Optimized design of contact interfaces for enhanced heat dissipation in flip-chip package
23天前
已完结
Multiscale filler network design enables solid–liquid reversible thermal interface materials with high thermal conductivity and low thermal resistance
23天前
已完结
Sandwich Structured Heat Dissipation Composite Consisting of Carbon Nanotube/Epoxy Resin and Boron Nitride/Epoxy Resin
1个月前
已关闭
Preparation of highly thermally conductive epoxy resin composites via hollow boron nitride microbeads with segregated structure
1个月前
已完结
Construction of thermal conduction networks and decrease of interfacial thermal resistance for improving thermal conductivity of epoxy natural rubber composites
1个月前
已完结
Chiroπ‐Extended Helitwistacene: Resolving the Planarity–Helicity Dilemma for Broadband Circularly Polarized Light Detection
1个月前
已完结
Machine‐Learning‐Enhanced Trial‐and‐Error for Efficient Optimization of Rubber Composites
5个月前
已完结
Understanding N-site substituents effect on corrosion inhibition performance of benzotriazoles derivatives in copper chemical mechanical planarization: Theoretical and experimental analysis
6个月前
已采纳
Single-Stage Isolated AC–DC Converter Based on LCL Resonant DAB Converters With Single-Loop Control
6个月前
已采纳
95‐2: Ultra‐Small Pixel Color‐Conversion Arrays for MicroLED Displays with Color‐Purification Enhanced Color Gamut
6个月前
已采纳
Research note: On relation between photopic luminous efficacy and colour rendering of LED strips
7个月前
已采纳
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