Lv1
10 积分 2024-02-27 加入
Accumulative roll 5 cycles forged Cu/Ag multilayered preforms for high-temperature die-attach interconnections
4个月前
已完结
Thermal conductivity and reliability reinforcement for sintered microscale Ag particle with AlN nanoparticles additive
9个月前
已完结
The immiscible W/Cu composites with heterostructures and excellent bond strength prepared by additively manufactured transient liquid-phase direct bonding: Experiments and simulations
9个月前
已完结
The immiscible W/Cu composites with heterostructures and excellent bond strength prepared by additively manufactured transient liquid-phase direct bonding: Experiments and simulations
10个月前
已完结
Accumulative roll 5 cycles forged Cu/Ag multilayered preforms for high-temperature die-attach interconnections
10个月前
已完结
Accumulative roll 5 cycles forged Cu/Ag multilayered preforms for high-temperature die-attach interconnections
11个月前
已关闭
Accumulative roll 5 cycles forged Cu/Ag multilayered preforms for high-temperature die-attach interconnections
11个月前
已关闭
皖公网安备34019202002308
