Lv1
16 积分 2025-04-25 加入
Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs
4天前
已完结
Micrometer-scale composite pin-fin diamond microchannel heat sink for near-10-kilowatt-level chip thermal management
1个月前
已完结
Highly efficient bio-inspired manifold microchannel cooling for steady-state and transient thermal management of high-power chips
1个月前
已完结
Hydrogenolysis of LDPE over Ni-catalyst promoted by n-hexane solvent
3个月前
已完结
Shell and tube heat exchanger flexible design strategy for process operability
5个月前
已完结
皖公网安备34019202002308
