Lv11
70 积分 2025-02-18 加入
Maximum achievable aspect ratio in deep reactive ion etching of silicon due to aspect ratio dependent transport and the microloading effect
42分钟前
已关闭
Cyclic, Cryogenic, Highly Anisotropic Plasma Etching of Silicon Using SF6/O2
1个月前
已完结
Formation mechanisms of etched feature profiles during Si etching in Cl2/O2 plasmas
2个月前
已关闭
Modeling of microtrenching and bowing effects in nanoscale Si inductively coupled plasma etching process
9个月前
已完结
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