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18 积分 2024-07-26 加入
Multi-Physics Coupling in IGBT Modules: A Review
2天前
已完结
Creep of copper: 4–300 K
23天前
已完结
Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits
26天前
已完结
Microstructure evolution and mechanical properties of copper bonding wire during continuous annealing
26天前
已完结
Thermomechanical Reliability and Constitutive Investigation of Copper Through-Glass Via in Glass Interposer
1个月前
已完结
The stress - strain behaviour of copper over a large strain range
1个月前
已完结
Near-Perfect Elastoplasticity in Pure Nanocrystalline Copper
1个月前
已完结
The interfacial reliability of through-glass vias for 2.5D integrated circuits
2个月前
已完结
Integrated chips: An interdisciplinary evolution in the Post-Moore Era
4个月前
已关闭
A Stable Cu Nanoparticles Used for Seed Layer Deposition of through Silicon Via
5个月前
已关闭
A YOLOv7 Forest Fire Detection System with Edge Computing
26天前
已采纳
面向学龄儿童脑智发育研究的多模态MRI脑影像序列参数与扫描规范专家共识
26天前
已采纳
Lead-Free Perovskite Tandem Solar Cells with Wide Bandgap Tin Perovskite and CIGS
1个月前
已采纳
Resolving Activation Entropy of CO Oxidation under the Solid–Gas and Solid–Liquid Conditions from Machine Learning Simulation
1个月前
已采纳
Micropore System of Terrestrial Clay-Rich Shale from Dongyuemiao Member of Jurassic Ziliujing Formation in the Fuxing Area, Eastern Sichuan Basin
1个月前
已采纳
Mechanistic Insights into the Palladium-Catalyzed Perfluoroalkylative Carbonylation of Unactivated Alkenes to β-Perfluoroalkyl Esters: A DFT Study
6个月前
已采纳
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