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10 积分 2024-09-11 加入
Low-temperature sinterable copper paste with a flake-spherical hybrid network and enhanced anti-oxidation properties
4天前
已完结
Preparation and Characteristic of Ultrafine Copper-Based Powders Reduced by a Two-Step Reduction Method
4天前
已完结
High‐performance Cu–Cu interconnects attained through air sintering of oleylamine‐capped Cu nanoparticles for power electronics packaging
5天前
已完结
Preparation of Oleic Acid-capped Copper Nanoparticles
1个月前
已完结
Pressureless sinter-joining of copper pastes below 200 °C via multi-solvent collaborative engineering
6个月前
已完结
Achieving high adhesion and low‐temperature sintering for multilayer ceramic capacitors by tunning the structure of SrO‐ZnO‐B2O3‐SiO2 glass
6个月前
已完结
Tuning the rheology of copper pastes with reliable printability and enhanced storage stability
6个月前
已完结
Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging
6个月前
已完结
Development of high-performance Cu nanoparticle paste and low-temperature sintering for Cu–Cu bonding
6个月前
已完结
High-performance Cu–Cu interconnects attained through air sintering of oleylamine-capped Cu nanoparticles for power electronics packaging
6个月前
已完结
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