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38 积分 2022-01-24 加入
Low-Resistance Cu–Cu Bonding With the Formic Acid-Treated Co Passivation Layer
9个月前
已完结
Sintering of Cu particles baked by formic acid vapor for Cu–Cu low temperature bonding
9个月前
已完结
Large area pressureless Cu-Cu bonding using formic acid-treated Cu particles for power device packaging
9个月前
已完结
The formation of Cu-Cu joints by low temperature sintering Cu NPs with copper formate layer and its oxidation enhancement
9个月前
已完结
Enhancement and Mechanism of Copper Nanoparticle Sintering in Activated Formic Acid Atmosphere at Low Temperature
9个月前
已完结
Nano-Cu paste sintering in Pt-catalyzed formic acid vapor for Cu bonding at a low temperature
9个月前
已完结
Enhancement of Copper Nanoparticle Paste by Pressure-less Sintering on Different Substrates in Pt-catalyzed Formic Acid Atmosphere
9个月前
已完结
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