Lv51
980 积分 2021-03-29 加入
(Invited) Trench-Gated MOSFET Instability Caused by High Temperature Reverse-Bias Stress
2小时前
已关闭
Junction leakage current degradation under high temperature reverse-bias stress induced by band-defect-band tunnelling in power VDMOS
2小时前
已完结
Surge Capability of SiC MOSFETs in the Third Quadrant: Impact of Advanced Packaging Structures
3个月前
已完结
Analysis of SiC Technology in Two-Level and Three-Level Converters for Aerospace Applications
5个月前
已完结
Printed circuit board embedded power semiconductors: A technology review
9个月前
已完结
In Situ Full-Field Deformation Characterization of Power Module and FEA Model Calibration Based on Stereo Digital Image Methodology
11个月前
已完结
Dynamic Deformation Oriented Thermo-Mechanical Performance Assessment for Automotive Power Module With Various PWM Schemes
11个月前
已完结
Direct Metallization-Based DBC-Free Power Modules for Near-Junction Water Cooling: Analysis and Experimental Comparison
11个月前
已完结
Forced Fluorinated Liquid Cooling for Medium Voltage SiC Power Modules: Concurrently Addressing Electrical and Thermal Challenges
11个月前
已完结
Transient Thermal Characterization and Assessment of Power Module With Encapsulated Phase Change Material Toward Overload Capability
11个月前
已完结
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