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40 积分 2021-03-29 加入
Printed circuit board embedded power semiconductors: A technology review
2个月前
已完结
In Situ Full-Field Deformation Characterization of Power Module and FEA Model Calibration Based on Stereo Digital Image Methodology
4个月前
已完结
Dynamic Deformation Oriented Thermo-Mechanical Performance Assessment for Automotive Power Module With Various PWM Schemes
4个月前
已完结
Direct Metallization-Based DBC-Free Power Modules for Near-Junction Water Cooling: Analysis and Experimental Comparison
4个月前
已完结
Forced Fluorinated Liquid Cooling for Medium Voltage SiC Power Modules: Concurrently Addressing Electrical and Thermal Challenges
4个月前
已完结
Transient Thermal Characterization and Assessment of Power Module With Encapsulated Phase Change Material Toward Overload Capability
4个月前
已完结
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