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90 积分 2025-04-10 加入
Electrodeposition of Co–Cu alloy coatings from glycinate baths
1个月前
已完结
Electromagnetic interference shielding effectiveness of electroless Cu-plated PET fabrics
1个月前
已完结
Microstructure of Electrodeposited Cu‐Ni Binary Alloy Films
1个月前
已完结
Protein interactions with bivalent tin. 1. Hydrolysis and complexation of tin(II) ion with glycine
2个月前
已关闭
Electrodeposition of Cu–Sn alloys: theoretical and experimental approaches
2个月前
已完结
Electrodeposition of Sn-Cu Alloy from Methanesulfonate Bath
3个月前
已关闭
Electrochemical plating of Cu-Sn alloy in non-cyanide solution to substitute for Ni undercoating layer
4个月前
已完结
Electrochemical processes in weakly acid solutions containing Cu(II)-glycine complexes
6个月前
已完结
Electrochemical behaviour of copper in alkaline glycine solutions
6个月前
已完结
DMH and NA–based cyanide-free silver electroplating bath: a promising alternative to cyanide ones in microelectronics
9个月前
已完结
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