Lv51
1130 积分 2023-02-15 加入
Clarifying the mechanism of actions of suppressor, brightener and sodium chloride in acid copper electrodeposition: A multidisciplinary approach for a many variable problem
12小时前
已完结
A Study of the Influence of Microstructure, Nodulation and Barrier on Signal Integrity
17天前
已完结
High-Speed Signal Transmission Comparative Analysis of Huray and Groisse Models for Copper Foil Surface Roughness
17天前
已完结
Exploration of the Relationship Between Copper Foil Microstructure and Etching Behavior on PCB Signal Integrity
17天前
已完结
Evaluation of Electrolytically Manufactured Copper Foils Properties
17天前
已完结
Ultra Low Profile Copper Foil For Very Low Loss Material
18天前
已关闭
Advances in electrolytic copper foils: fabrication, microstructure, and mechanical properties
1个月前
已完结
Surface morphology and underlying mechanisms of HVLP copper foils with different additives
1个月前
已完结
Current status and frontiers of research on microstructure and mechanical properties of electrolytic copper foils
3个月前
已完结
Constructing a nickel-tetrazole molecular composite stripping layer for completely peeling off 2.5 μm ultra-thin copper foil
3个月前
已完结
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