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1030 积分 2023-02-15 加入
Advances in electrolytic copper foils: fabrication, microstructure, and mechanical properties
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Surface morphology and underlying mechanisms of HVLP copper foils with different additives
3小时前
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Current status and frontiers of research on microstructure and mechanical properties of electrolytic copper foils
2个月前
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Constructing a nickel-tetrazole molecular composite stripping layer for completely peeling off 2.5 μm ultra-thin copper foil
2个月前
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Enhancement of Tensile Strength in Electrodeposited Copper Foils Using Cetyltrimethylammonium Bromide as a Suppressor
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Achieving high-strength and high-ductility electrolytic copper foils through grain structure control
2个月前
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Texture and Flexural Fatigue Resistance Governed by Surface-Dependent Deformation and Recrystallization in the Copper Foils
2个月前
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Structure–Property Relationship in Ultra-Thin Copper Foils: From Nanotwinned to Fine-Grained Microstructures
2个月前
已完结