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2170 积分 2024-12-01 加入
Ultra-Precise Dispensing for High-Resolution Redistribution Layers and 3D Interconnects in Advanced Packaging Applications
12天前
已完结
A Novel FOPLP Structure with Chip First & RDL First Process for Automotive chip application
12天前
已完结
3D Printing of Interdigitated Finger Capacitors Using Ultra-Precise Deposition Technology
12天前
已完结
Ultra-Precise Deposition – XTPL Technology for 3D Printed Broadband Spiral Inductors
12天前
已完结
Ultrabroadband DC-Blocking Capacitors Using 3-D-Printed Interdigitated Finger Structures
12天前
已完结
Hybrid Integration of a Beam-Steering Leaky-Wave Antenna and Power Amplifier MMIC Using UPD Printing in 220 to 325 GHz Range
12天前
已完结
Printed Silicon Nanoribbon-Based Temperature Sensors on Flexible Substrates
12天前
已完结
UPD Printed 140 GHz Split Ring Resonator Antenna for Device-to-Device Communication
12天前
已完结
An Ultra-Precise Dispensing (UPD) Printed, Ultra-Broadband PCB to MMIC Interconnect
12天前
已完结
Power Integrity and Circuit Characteristics of Integrated Voltage Regulator (IVR) in CoWoS® Advanced Packaging Technology
24天前
已完结
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