Lv61
1810 积分 2024-12-01 加入
2nm Platform Technology Featuring Energy-Efficient Nanosheet Transistors and Interconnects Co-Optimized with 3DIC for AI, HPC and Mobile SoC Applications
3小时前
已完结
Advanced overlay metrology for CIS bonding applications
7天前
已完结
Atmospheric Pressure Plasma Jet (APPJ) Generation using Industrial Frequency Alternative Power Source
21天前
已完结
Development of Novel Photosensitive Polyimide with $170{ }^{\circ} \mathrm{C}$ Curing Process to Enable Low Warpage and Sub-$\mathbf{2} \mu \mathrm{m}$ Patterning for Rdls in Next Generation Interposer
2个月前
已完结
Technology Enhancements on Focos-Bridge for Emerging Trends in High-Performance Computing (HPC) and Artificial Intelligence (AI)
2个月前
已完结
Ultra High Density RDL Patterning of High–Resolution Dielectrics by Maskless Exposure Technology for High Performance Computing and Artificial Intelligence
2个月前
已完结
Flip-Chip Photonic-Electronic Integration Platform for Co-Packaged Optics Using a Glass Substrate with Vertically-Coupled Beam Expanding Lens
3个月前
已完结
Non-destructive mapping of electrical properties of semi-insulating compound semiconductor wafers using terahertz time-domain spectroscopy
3个月前
已完结
Thermal Challenges for HPC 3DFabricTM Packages and Systems
4个月前
已完结
High Thermal Graphite TIM Solution Applied to Fan-Out Platform
4个月前
已完结
皖公网安备34019202002308
