Lv437
570 积分 2024-12-01 加入
First Demonstration of Monolithic CFET Inverter at 48nm Gate Pitch Toward Future Logic Technology Scaling
21小时前
待确认
Novel Parallel Digital Optical Computing System (DOC) for Generative A.I
23小时前
已完结
EPIC-BOE: An Electronic-Photonic Chiplet Integration Technology with IC Processes for Broadband Optical Engine Applications
23小时前
已完结
Silicon Photonics Platform for Next Generation Data Communication Technologies
23小时前
已完结
Substrate Silicon Wafer Integrated Fan-out Technology (S-SWIFT®) Packaging with Fine Pitch Embedded Trace RDL
2天前
已完结
Processing Glass Substrate for Advanced Packaging using Laser Induced Deep Etching
22天前
已完结
Development of Laser-Induced Deep Etching Process for Through Glass Via
22天前
已完结
Optimization of Laser-induced Deep Etching for TGV Fabrication in Fused Silica
22天前
已完结
Laser micro drilling of around 3 microns into Ajinomoto Build-up Film
22天前
已完结
High Aspect Ratio (AR) Through Glass Via (TGV) Etch Performance on Glass Core Substrates for High Density 3D Advanced Packaging Applications
22天前
已完结
皖公网安备34019202002308
