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3060 积分 2022-09-09 加入
Intel Details EMIB-T Advanced Packaging for HBM4 and UCIe
7天前
已完结
Integrated Glass Waveguide Circuit for Co-packaged Optics in Radio-Access Networks
10天前
已完结
Large-Scale Glass Waveguide Circuit for Board-Level Optical Interconnects Between Faceplate and Co-Packaged Optical Transceivers
10天前
已完结
Advanced Glass Substrate Fabrication and Metallization Process Technology for Co-Packaged Optics
10天前
已完结
A 64 Gb/s NRZ O-Band Ring Modulator with 3.2 THz FSR for DWDM Applications
13天前
已关闭
Tantalum Pentoxide Integrated Photonics: A Promising Platform for Low-Loss Planar Lightwave Circuits with Low Thermo-Optic Coefficients
3个月前
已完结
A theoretical analysis of scattering loss from planar optical waveguides
4个月前
已完结
Ultra-Low-Loss PECVD SiN Photonic Platforms At Telecom Wavelengths: Comparison Between Modeling and Experimental Results
4个月前
已完结
Rethinking the surface of optical waveguides
4个月前
已完结
Measurements and Modeling of Atomic-Scale Sidewall Roughness and Losses in Integrated Photonic Devices
4个月前
已完结
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