Lv4
440 积分 2021-06-29 加入
Method of Improving Simulation Accuracy by Curing Shrinkage of Molding Compound
15天前
已完结
Study on Warpage after Post Solidifying of Ultrathin Fingerprint Package Products
22天前
已完结
Warpage Simulation Including the Effect of Molding Compound Cure Shrinkage
22天前
已完结
Warpage Simulation Including Effect of Process and MC Curing Shrinkage
22天前
已完结
Effect of Effective Curing Shrinkage of EMC on Strip Warpage During IC Encapsulation Process
23天前
已完结
Developing a Simulation Model to Improve Strip Warpage Performance Predictability
23天前
已完结
Finite Element Analysis of Interfacial Delamination in Double Side Molding Power Module SiP During Reflow
29天前
已完结
Research on Reliability of SnAg1.8/Cu Solder Joints in Extreme Environment
1个月前
已完结
Investigation on the thermo-mechanical reliability of bump with different solder shape in ultra-large size FCBGA package
1个月前
已完结
Optimization of Thermocompression Bonding Process for Fine-Pitch Flip-Chip Applications
1个月前
已完结
皖公网安备34019202002308
