Lv1
9 积分 2021-03-04 加入
On-Die Power-Rails Isolation Using Package Loop Inductance
1个月前
已完结
Analysis of the Resistance of TSV in TSV-Based Inductors with Air Core
2个月前
已完结
Electrical Modeling and Performance Analysis of Cu and CNT based TSV-bump-RDL
2个月前
已完结
High-Frequency Transmission Characteristic Analysis of TSV-RDL Interconnects
2个月前
已完结
An A-$\Phi$ Formulation Solver in Electromagnetics Based on Discrete Exterior Calculus
10个月前
已完结
Equivalent thermal model of through silicon via and bump for advanced packaging of integrated circuits
11个月前
已完结
A RTC-DG Method for Electrical-Thermal-Stress Analysis of 3-D Packages of Integrated Circuits with Micro-Fluidic Cooling
1年前
已完结
Thermal contact conductance; theoretical considerations
1年前
已完结
Transient Thermal Analysis of System-in-Package Technology by the Finite Element Method (FEM)
1年前
已完结
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