SciHub
文献互助
期刊查询
一搜即达
科研导航
交流社区
登录
注册
发布
文献
求助
首页
我的求助
捐赠本站
sugar
Lv1
5 积分
2021-03-04 加入
最近求助
最近应助
互助留言
Equivalent thermal model of through silicon via and bump for advanced packaging of integrated circuits
24天前
已完结
A RTC-DG Method for Electrical-Thermal-Stress Analysis of 3-D Packages of Integrated Circuits with Micro-Fluidic Cooling
4个月前
已完结
Transient electrical-thermal co-simulation in the design of on-chip and 3-D interconnects
4个月前
已关闭
Thermal contact conductance; theoretical considerations
4个月前
已完结
Transient Thermal Analysis of System-in-Package Technology by the Finite Element Method (FEM)
5个月前
已完结
Nodal High-Order Methods on Unstructured Grids
5个月前
已完结
A non-overlapping domain decomposition method with non-matching grids for modeling large finite antenna arrays
5个月前
已完结
Skin effect and proximity effect analysis of stranded conductor based on mixed order MoM with adaptive cross approximation algorithm
6个月前
已完结
A Hybrid PEEC-SPICE Method with Curved Triangular Meshes for Coupled Circuit-Electromagnetic Simulation of PCB/Flex Circuit
7个月前
已完结
Implementation of Multi-Expansion Point Model Order Reduction for Coupled PEEC-Semiconductor Simulations
1年前
已完结
没有进行任何应助
谢谢
3年前
最近帖子
最近评论
没有发布任何帖子
没有发布任何评论