Lv11
38 积分 2026-03-04 加入
Enhanced temperature uniformity of electrostatic chuck: ceramic surface contact ratio and backside gas pressure
8小时前
已完结
Heat transfer mechanism of electrostatic chuck surface and wafer backside to improve wafer temperature uniformity
9小时前
已完结
Like-charge attraction between two identical dielectric spheres in a uniform electric field: a theoretical study via a multiple-image method and an effective-dipole approach
2个月前
已完结
Design and kinetostatic analysis of a tip-stiffness improved compliant continuum robot using anti-buckling universal joints
3个月前
已完结
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