Lv41
600 积分 2024-09-26 加入
Evolution of the Intermetallic Compounds in Ni/Sn-2.5Ag/Ni Microbumps for Three-Dimensional Integrated Circuits
3小时前
待确认
A 3D numerical study of a molten solder droplet's wetting and solidifying on a pillar with application to electronic packaging
3小时前
已完结
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management
3小时前
待确认
Design, fabrication and assembly of a novel electrical and microfluidic I/Os for 3-D chip stack and silicon interposer
4小时前
待确认
Recent Developments in Thermal Management of 3D ICs: A Review
4小时前
已完结
A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)
4小时前
已完结
Analysis of hotspots and cooling strategy for multilayer three-dimensional integrated circuits
5小时前
待确认
Combination of FEM simulations and shearography for defect detection on artwork
5天前
已完结
Thermal response and resistance optimization of various types of point-supported glass facades
5天前
已完结
Numerical Investigation of Heat Transfer and Pressure Loss of Double-Layer Microchannels for Chip Liquid Cooling
1个月前
已完结
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