Lv4
500 积分 2024-09-26 加入
Unlocking the true potential of 3D CPUs with micro-fluidic cooling
19天前
已完结
Thermo-mechanical reliability of 3-D ICs containing through silicon vias
20天前
已完结
Numerical investigation on the characteristics of flow and heat transfer enhancement by micro pin-fin array heat sink with fin-shaped strips
20天前
已完结
Experimental and numerical investigation of hydrothermal performance of a microchannel heat sink with pin fins
20天前
已完结
A High-Efficiency Design Method of TSV Array for Thermal Management of 3-D Integrated System
22天前
已完结
Hot-LEGO: Architect Microfluidic Cooling Equipped 3DIC with Pre-RTL Thermal Simulation
22天前
已完结
Thermal and Mechanical Analysis of Embedded Liquid Cooling with Microchannel and Pin-fin Structures
22天前
已完结
CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling for 3D Stacked ICs
22天前
已完结
The Impact of Process Variations on the Thermo-Mechanical Behavior of 3D Integrated Circuits
1个月前
已完结
Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)
1个月前
已完结
皖公网安备34019202002308
