Lv4
730 积分 2024-09-26 加入
Innovative SoIC® Cool-Stacking Technology to Overcome the Thermal Wall of Future High Performance Compute
9小时前
待确认
SECOND LAW CONSTRUCTAL DESIGNS OF HYBRID SINGLE-FINNED AND STAGGER-FINNED MICROCHANNEL HEAT SINKS
2个月前
已完结
Machine Learning for 3D-IC Electric-Thermal Simulation and Management
2个月前
已完结
Thermal Management for 3D-Stacked Systems via Unified Core-Memory Power Regulation
2个月前
已完结
A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)
3个月前
已完结
Heat transfer and pressure drop characteristics of microchannel cold plate in commercial CPU-package cooling system
4个月前
已完结
Experimental and numerical study of micro-pin-fin heat sinks with variable density for increased temperature uniformity
4个月前
已完结
Advanced Chip-to-Substrate Connections
4个月前
已完结
3D-programmable streamline guided orientation in composite materials for targeted heat dissipation
4个月前
已完结
A review of thermal performance of 3D stacked chips
4个月前
已完结
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