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690 积分 2024-09-26 加入
Study on the Flow and Heat Transfer Characteristics in Manifold Microchannels with Column-Row Structures
3小时前
求助中
Thermal management enhancement of electronic chips based on novel technologies
2个月前
已完结
Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sink
2个月前
已完结
Micro-Fluidic Cooling for Stacked 3D-ICs: Fundamentals, Modeling and Design
2个月前
已完结
Optimization of embedded cooling in 2.5D integrated circuits through genetic algorithm-driven TSV layout design
2个月前
已完结
Innovative SoIC® Cool-Stacking Technology to Overcome the Thermal Wall of Future High Performance Compute
2个月前
已完结
SECOND LAW CONSTRUCTAL DESIGNS OF HYBRID SINGLE-FINNED AND STAGGER-FINNED MICROCHANNEL HEAT SINKS
4个月前
已完结
Machine Learning for 3D-IC Electric-Thermal Simulation and Management
4个月前
已完结
Thermal Management for 3D-Stacked Systems via Unified Core-Memory Power Regulation
5个月前
已完结
A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)
5个月前
已完结
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