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360 积分 2024-09-26 加入
CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling for 3D Stacked ICs
3天前
已完结
Through-chip microchannels for three-dimensional integrated circuits cooling
3天前
已关闭
Through-chip microchannels for three-dimensional integrated circuits cooling
3天前
已关闭
Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips
3天前
已完结
Heat transfer characteristics of nanofluid under the action of magnetic field based on molecular dynamics and flow states
7个月前
已完结
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