Lv4
470 积分 2024-09-26 加入
Experimental and numerical study of micro-pin-fin heat sinks with variable density for increased temperature uniformity
3小时前
已完结
Advanced Chip-to-Substrate Connections
9小时前
已完结
3D-programmable streamline guided orientation in composite materials for targeted heat dissipation
9小时前
已完结
A review of thermal performance of 3D stacked chips
6天前
已完结
Thermal-aware floorplanner for 3D IC, including TSVs, liquid microchannels and thermal domains optimization
6天前
已关闭
Thermal management in TSV based 3D IC Integration: A survey
6天前
已完结
A Review on the Chemical Vapor Deposition Synthesis of 2D Materials and Their Applications
20天前
已完结
Chemical vapour deposition
20天前
已完结
CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling for 3D Stacked ICs
1个月前
已完结
Through-chip microchannels for three-dimensional integrated circuits cooling
1个月前
已关闭
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