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60 积分 2024-10-11 加入
Reliability Behavior of A Resin-Free Nanosilver Paste at Ultra-Low Temperature of 180°C
3个月前
已完结
Pulsed electric current-assisted transient liquid phase sintering for extremely reliable Cu-Cu direct bonding
3个月前
已完结
Self-oxygenation silver paste for SiC power modules with high thermal dissipation reliability
3个月前
已完结
Electric Field Mitigation in (U)WBG Power Module Using Nonlinear Field-Dependent Conductivity Layer and Protruding Substrate Under High-Frequency, High-Slew-Rate Square Wave Voltages
5个月前
已完结
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