Lv11
4 积分 2024-04-11 加入
Challenge and warpage optimization of thermal compression bonding technology on coreless substrates
3小时前
已完结
Thermocompression Bonding Process Design and Optimization for Warpage Mitigation of Ultra-Thin Low-CTE Package Assemblies
4小时前
已完结
Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
13天前
已完结
Stress Analysis and Design Optimization for Low- $k$ Chip With Cu Pillar Interconnection
14天前
已完结
Influence of Underfill and EMC Material Properties on Bump Stresses in 2.5D CoWoS Packaging
1个月前
已完结
Study of fabrication and reliability for 120 mm x 120 mm extremely large advanced 2.5D package
1个月前
已完结
Fracture Modeling and Characterization of Si/Underfill/Substrate Interface Adhesion in 3D Packaging
1个月前
已完结
Thermal Management Challenges in 2.5D and 3D Chiplet Integration: A Review on Architecture–Cooling Co-Design
2个月前
已完结
Silicon Interposer Reliability Optimization through Process-Oriented Stress Modeling
2个月前
已完结
Prediction of deformation during manufacturing processes of silicon interposer package with TSVs
2个月前
已完结
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