Lv1
10 积分 2024-04-11 加入
Novel method of wafer-level and package-level process simulation for warpage optimization of 2.5D TSV
1天前
已完结
Predicting reliability behavior in HBM packages through numerical simulation
2天前
已完结
Investigation on thermal-mechanical reliability and enhanced fatigue life of indium thermal interface materials for large-size flip chip packaging
7天前
已完结
Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages
9天前
已完结
Warpage Study of Large 2.5D IC Chip Module
11个月前
已完结
Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability
11个月前
已完结
Warpage Prediction and Optimization for Wafer Level Glass Interposer Packaging
1年前
已完结
Thermal and Mechanical Lid Design for a Multi-Chip Modular Flip-Chip Package
1年前
已完结
TIM Coverage Evaluation for High Performance Computing Application
1年前
已完结
Warpage Prediction and Optimization for Embedded Silicon Fan-Out Wafer-Level Packaging Based on an Extended Theoretical Model
1年前
已完结
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