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50 积分 2024-03-16 加入
Direct copper electrodeposition on cobalt substrate in acidic solutions with organic and halide additives
1个月前
已完结
Accelerator-free through silicon vias electroplating based on novel polysuccinimide derivatives suppressors
1个月前
已完结
Catalytic synthesis of butene-1 by ethylene dimerization
3个月前
已关闭
Molecular precursors for the electrodeposition of 2D-layered metal chalcogenides
4个月前
已完结
Two-dimensional material assisted-growth strategy: new insights and opportunities
5个月前
已完结
Galvanostatic studies of the nucleation and growth kinetics of copper in the presence of surfactants
11个月前
已完结