Lv5
1010 积分 2025-11-27 加入
COMSOL Simulation to Predict the Thickness of Material Removed from Surface During Electropolishing
2天前
已完结
Impact of H 2 O 2 on 4H-SiC during electrochemical anodic oxidation
11天前
已完结
In-situ ECMP polishing of silicon wafers assisted by piezo-electric abrasives
18天前
已完结
Enhanced oxidation–dissolution theory of electropolishing
20天前
已完结
Material removal rate model for chemical–mechanical polishing of single-crystal SiC substrates using agglomerated diamond abrasive
1个月前
已完结
Evolving Preston’s Equation in Chemical Mechanical Planarization
1个月前
已关闭
Selective electrochemical mechanical polishing of 4H–SiC surface employing porous material impregnated with electrolyte
1个月前
已完结
Research progress in novel chemical–mechanical synergistic enhanced polishing methods for silicon carbide substrates
1个月前
已完结
Investigating Virtual Reality for Alleviating Human-Computer Interaction Fatigue: A Multimodal Assessment and Comparison with Flat Video
2个月前
已完结
CFD modeling of MEA-based CO2 spray scrubbing with computational-effective interphase mass transfer description
2个月前
已完结
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