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98 积分 2025-06-26 加入
Graphene-covered copper substrates for soldering applications: Experimental and atomistic insights into interfacial reactions and wetting with SAC305
39分钟前
待确认
Wetting characteristics of Zn on Fe surfaces and its influencing factors: Molecular dynamics simulation
1小时前
已完结
Influence and mechanism of ultrafast laser-textured Cu substrate on wetting behavior of SAC305 solder
1小时前
求助中
Wetting behavior of Cu droplets on Fe Surfaces: Insights from molecular dynamics simulations
1小时前
求助中
Dissolution wetting of liquid copper on steel substrate – phenomena occurring during liquid-solid interaction
1小时前
求助中
Wetting Behavior of Zn Droplets on Fe Surfaces: Insights from Molecular Dynamics Simulations
1小时前
已完结
Molecular dynamics study of high temperature wetting kinetics for Al/NiAl and Al/Ni3Al systems: Effects of grain boundaries
2小时前
已完结
Kinetics of wetting and spreading of AgCu filler metal over Ti–6Al–4V substrates
2小时前
已完结
Spreading behavior of AgCuTi/Cu at elevated temperatures: A molecular dynamics study
2小时前
已完结
Experimental and molecular dynamics simulation of wetting and spreading of Al-Si brazing filler metal on Fe Substrate: Element diffusion and interfacial compounds
19小时前
已完结
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