Lv4
720 积分 2021-10-17 加入
用于功率芯片互连的高性能无压烧结纳米铜膏制备与制程工艺优化
6天前
已完结
功率器件芯片互连用低温烧结铜基电子浆料研究进展
6天前
已完结
低温有压铜烧结的互连机理及可靠性研究
6天前
已完结
低温烧结纳米铜焊膏的制备及其连接性能分析
6天前
已完结
铜纳米颗粒合成及其低温烧结互连行为研究
6天前
已完结
Effect of Reduction Process of CuO on Bondability in Joining Using CuO Paste
1个月前
已关闭
Cu-Cu joint formation by low-temperature sintering of self-reducible Cu nanoparticle paste under ambient condition
1个月前
已完结
Anti-oxidative copper nanoparticle paste for Cu–Cu bonding at low temperature in air
2个月前
已完结
Fabrication of Conductive Copper Films on Flexible Polymer Substrates by Low-Temperature Sintering of Composite Cu Ink in Air
2个月前
已关闭
Air-sinterable copper pastes for next-generation electronics: a review
2个月前
已完结
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