Lv3
230 积分 2022-10-04 加入
Adhesive wafer bonding
15天前
已完结
Etch rates for micromachining processing
1个月前
已完结
Experimental study of improvement shear strength and moisture effect PVP adhesive joints by addition PVA
3个月前
已完结
Mechanical Strength Characterization for Silicon-to-Silicon Direct Bonding
3个月前
已完结
Development of a test method for measuring the mixed mode fracture resistance of bimaterial interfaces
3个月前
已完结
Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications
9个月前
已完结
Degradation and stabilisation of styrene–ethylene–butadiene–styrene (SEBS) block copolymer
10个月前
已完结
Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications
11个月前
已完结
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