Lv3
250 积分 2022-10-04 加入
Adhesive wafer bonding
4个月前
已完结
Etch rates for micromachining processing
4个月前
已完结
Experimental study of improvement shear strength and moisture effect PVP adhesive joints by addition PVA
7个月前
已完结
Mechanical Strength Characterization for Silicon-to-Silicon Direct Bonding
7个月前
已完结
Development of a test method for measuring the mixed mode fracture resistance of bimaterial interfaces
7个月前
已完结
Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications
1年前
已完结
Degradation and stabilisation of styrene–ethylene–butadiene–styrene (SEBS) block copolymer
1年前
已完结
Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications
1年前
已完结
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