Lv5
976 积分 2024-02-21 加入
Fatigue cracking growth of SAC305 solder ball under rapid thermal shock
6天前
已完结
Property of Sn-37Pb solder bumps with different diameter during thermal shock
6天前
已完结
Microstructure Evolution of TiB2/7075 Composites in Semi-Solid State near Liquids within Holding Time
6天前
已完结
Influence of thermal shock cycles on Sn-37Pb solder bumps
6天前
已完结
Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam
1个月前
已完结
NiPdAu top Metal for Clip and Cu/Au Wire Bonding in a Hybrid Package
2个月前
已完结
Investigation on the Electrical–Thermal–Mechanical Performance of Multichip SiC Power Device With Cu-Clip Interconnect
2个月前
已完结
Microstructure and Mechanical Properties of Ultrasonically Assisted Brazing of Dissimilar Cu–Al Alloys
5个月前
已完结
Ligand‐Engineered Cu@Ni Core‐Shell Nanoparticles with Excellent Performance for Printed Electronics
7个月前
已完结
Machine Learning Boosted Entropy-Engineered Synthesis of CuCo Nanometric Solid Solution Alloys for Near-100% Nitrate-to-Ammonia Selectivity
9个月前
已完结
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