Lv5
1006 积分 2024-02-21 加入
The thermal cycling response of Sn-Zn, Sn-Ag-Cu and Sn-Bi solder in industrial production
22天前
已完结
Anharmonic phonons, thermal expansion, and nuclear quantum effects in Zn
22天前
已完结
Effect of Cu content on properties of Cu/Zn+15%SAC0307+xCu/Al joint by ultrasonic excitation at low temperature
1个月前
已完结
Fatigue cracking growth of SAC305 solder ball under rapid thermal shock
1个月前
已完结
Property of Sn-37Pb solder bumps with different diameter during thermal shock
1个月前
已完结
Microstructure Evolution of TiB2/7075 Composites in Semi-Solid State near Liquids within Holding Time
1个月前
已完结
Influence of thermal shock cycles on Sn-37Pb solder bumps
1个月前
已完结
Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam
3个月前
已完结
NiPdAu top Metal for Clip and Cu/Au Wire Bonding in a Hybrid Package
3个月前
已完结
Investigation on the Electrical–Thermal–Mechanical Performance of Multichip SiC Power Device With Cu-Clip Interconnect
3个月前
已完结
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