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156 积分 2024-02-21 加入
Ligand‐Engineered Cu@Ni Core‐Shell Nanoparticles with Excellent Performance for Printed Electronics
1个月前
已完结
Machine Learning Boosted Entropy-Engineered Synthesis of CuCo Nanometric Solid Solution Alloys for Near-100% Nitrate-to-Ammonia Selectivity
3个月前
已完结
The cluster-plus-glue-atom models of solid solution CuNi alloys: A first-principles study
3个月前
已完结
Self-Organizing, Environmentally Stable, and Low-Cost Copper–Nickel Complex Inks for Printed Flexible Electronics
3个月前
已完结
Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperature
3个月前
已完结
Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees
3个月前
已完结
Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature
3个月前
已完结
Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted
3个月前
已完结
Investigation of the mechanical properties of lead-free Sn-58Bi solder alloy with cobalt addition through flux doping
3个月前
已完结
Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees
4个月前
已完结
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