Lv5
996 积分 2024-02-21 加入
Interfacial reactions in electrodeposited Cu-Bi-Sn multilayers
23天前
已完结
Effect of double-side cooling packaging on the properties of dual-base-island packaging
24天前
已完结
Low-temperature Cu/Al solid-state bonding with SAC307 + Zn composite interlayer: achieving robust long-term isothermal aging reliability via ultrasonic-assistance
1个月前
已完结
Fatigue cracking growth of SAC305 solder ball under rapid thermal shock
1个月前
已完结
The thermal cycling response of Sn-Zn, Sn-Ag-Cu and Sn-Bi solder in industrial production
2个月前
已完结
Anharmonic phonons, thermal expansion, and nuclear quantum effects in Zn
2个月前
已完结
Effect of Cu content on properties of Cu/Zn+15%SAC0307+xCu/Al joint by ultrasonic excitation at low temperature
3个月前
已完结
Fatigue cracking growth of SAC305 solder ball under rapid thermal shock
3个月前
已完结
Property of Sn-37Pb solder bumps with different diameter during thermal shock
3个月前
已完结
Microstructure Evolution of TiB2/7075 Composites in Semi-Solid State near Liquids within Holding Time
3个月前
已完结
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