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292 积分 2024-02-21 加入
Effect of adding Ni nanoparticles on the melting characteristics, mechanical properties and intermetallic compound growth of Sn58Bi solder
7小时前
待确认
Shape Synergy of Ag@Cu Chip Packaging Nano‐Paste and Its Sintering Reliability
1天前
已完结
Effect of adding Ni nanoparticles on the melting characteristics, mechanical properties and intermetallic compound growth of Sn58Bi solder
1个月前
已完结
Epitaxial growth of Ag-Cu bimetallic nanoparticles via thermal evaporation deposition
1个月前
已完结
Effect of adding Ni nanoparticles on the melting characteristics, mechanical properties and intermetallic compound growth of Sn58Bi solder
1个月前
已完结
Sn–Bi–Ag Solder Enriched with Ta2O5 Nanoparticles for Flexible Mini-LED Microelectronic Packaging
1个月前
已完结
Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere
1个月前
已完结
Room-Temperature Synthesis of Intermetallic Cu–Zn by an Electrochemically Induced Phase Transformation
2个月前
已完结
Full‐Color Long‐Lived Room Temperature Phosphorescence in Aqueous Environment
2个月前
已完结
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