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10 积分 2025-07-04 加入
Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5
14天前
已完结
The Cu–Sn System: A Comprehensive Review of the Crystal Structures of its Stable and Metastable Phases
15天前
已完结
Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5
15天前
已完结
Critical properties of Cu 6 Sn 5 in electronic devices: Recent progress and a review
15天前
已完结
Understanding the Noncollinear Antiferromagnetic IrMn3 Surfaces and Their Exchange-Biased Heterostructures from First-Principles
15天前
已关闭
Insight into the improvement of service performance of Sn/Cu solder joint by Pt doping in Cu6Sn5 interfacial intermetallic compound
15天前
已完结
Structural and elastic properties of Cu6Sn5 and Cu3Snfrom first-principles calculations
1个月前
已完结
Effect of trace platinum additions on the interfacial morphology of Sn–3.8Ag–0.7Cu alloy aged for long hours
1个月前
已关闭
First-Principles Calculations of Elastic Properties of Cu$_{3}$Sn and Cu$_{6}$Sn$_{5}$ Intermetallics
1个月前
已完结
Spin-Flip Diffusion Length in 5d Transition Metal Elements: A First-Principles Benchmark
9个月前
已完结
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