Lv41
480 积分 2023-05-23 加入
Ultrahigh-solid-content silica/epoxy composite for high-performance semiconductor packaging
6小时前
已完结
Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test
1个月前
已完结
The state-of-the-art of power electronics converters configurations in electric vehicle technologies
1个月前
已完结
Performance limits of high voltage press-pack SiC IGBT and SiC MOSFET devices
1个月前
已完结
A Step‐by‐Step Approach for Replacing Si‐IGBTs With SiC‐MOSFETs Modules in Industrial Power Converters
1个月前
已完结
A review of silicon carbide MOSFETs in electrified vehicles: Application, challenges, and future development
1个月前
已完结
Optimization of inductive fast-curing of epoxy adhesive by model-based kinetics
1个月前
已完结
A comprehensive study of electrically switchable adhesives: Bonding and debonding on demand
2个月前
已完结
DSC and DEA studies of underfill curing kinetics
2个月前
已完结
Encapsulation of Nucleic Acids into Giant Unilamellar Vesicles by Freeze-Thaw: a Way Protocells May Form
2个月前
已完结
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