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rorrons
Lv4
660 积分
2023-05-23 加入
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Rapid cure composites in electronics industry
12天前
已完结
Probing Interfacial Aging of Model Adhesion Joints under a Hygrothermal Environment at a Molecular Level
13天前
已完结
Effects of Temperature on the Adhesive Performance of High Tg Underfill in 2.5D Heterogeneous Integrated Packaging
13天前
已完结
Testing method to determine the strength and fracture toughness of adhesives in a single continuous test
1个月前
已完结
Simulation of crack propagation in solder layer of IGBT device under temperature shock by viscoplastic phase field method
1个月前
已完结
Comparative Tests of Shear Strength of Adhesive Lap Joints after Thermal Shocks
1个月前
已关闭
Detection and analysis of novel and known plant volatile apocarotenoids
1个月前
已完结
Practice for Determination of Volatiles in Polymers by Static Headspace Gas Chromatography
1个月前
已完结
Impact, Shock and Vibration Characteristics of Epoxy‐Based Composites for Structural Adhesive Joints
2个月前
已关闭
Shrinkage stress of thermal cured epoxy resin reduced by addition of functional hollow microspheres
3个月前
已完结
没有进行任何应助
帮大忙了,感谢
12天前
速度真快,帮大忙了
13天前
速度真快,帮大忙了
13天前
感谢,帮大忙了
1个月前
已找到【积分已退回】
1个月前
感谢,帮大忙了
1个月前
已找到【积分已退回】
2个月前
速度真快,感谢
3个月前
感谢,速度真快
3个月前
速度真快,帮大忙了
3个月前
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