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118 积分 2024-12-06 加入
Polarization dependences of the laser in 4H-SiC wafer slicing
19天前
已完结
Low-damage precision slicing of SiC by simultaneous dual-beam laser-driven crack expansion of silicon carbide
21天前
已完结
MHz burst-mode femtosecond laser slicing of n-type 4H-SiC wafer: From initiating to propagating cracks
21天前
已关闭
Fabrication of through holes in silicon carbide using femtosecond laser irradiation and acid etching
1个月前
已完结
Crack control for efficient nanosecond-laser slicing of large-size 4H-SiC crystals
10个月前
已完结
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