Lv2
110 积分 2024-12-06 加入
Low-damage precision slicing of SiC by simultaneous dual-beam laser-driven crack expansion of silicon carbide
1天前
已完结
MHz burst-mode femtosecond laser slicing of n-type 4H-SiC wafer: From initiating to propagating cracks
1天前
已关闭
Fabrication of through holes in silicon carbide using femtosecond laser irradiation and acid etching
1个月前
已完结
Crack control for efficient nanosecond-laser slicing of large-size 4H-SiC crystals
9个月前
已完结
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