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110 积分 2026-06-08 加入
Numerical Optimization of Thermally Induced Hysteresis Effects in the Packaging of MEMS Pressure Sensors
1小时前
待确认
Anisotropic conductive adhesion of microsensors applied in the instance of a low pressure sensor
4个月前
已完结
Thermomechanical analysis of gold-based SiC die-attach assembly
4个月前
已完结
A 350 °C piezoresistive n-type 4H-SiC pressure sensor for hydraulic and pneumatic pressure tests
4个月前
已完结
Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging
4个月前
已完结
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