Lv31
366 积分 2024-12-24 加入
Microvia filling by copper electroplating using 2-aminobenzothiazole as a leveler
2小时前
待确认
Recent Advances and Trends in Advanced Packaging
2个月前
已完结
Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs
2个月前
已完结
Electroless silver plating on through-glass via (TGV) as an adhesive and conducting layer
4个月前
已完结
Friction and Abrasion Durability of Polymer Thin Films Sputtered with a Polyimide Target and Adhesion Property to Copper Substrate (Nitrogen Gas Effect)
5个月前
已关闭
Revisiting the Polyethylene Glycol-Chloride Adsorption Structure on Cu Electrode in Sulfuric Acid Solution by Wide-Frequency ATR-SEIRAS
6个月前
已完结
Influence of Additives on Copper Electrodeposition on Physical Vapor Deposited (PVD) Copper Substrates
6个月前
已完结
Additive Behavior during Copper Electrodeposition in Solutions Containing Cl[sup −], PEG, and SPS
6个月前
已完结
A SERS study of the galvanostatic sequence used for the electrochemical deposition of copper from baths employed in the fabrication of interconnects
6个月前
已完结
A SERS study of the galvanostatic sequence used for the electrochemical deposition of copper from baths employed in the fabrication of interconnects
6个月前
已完结
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