Lv3
326 积分 2024-12-24 加入
Electroless silver plating on through-glass via (TGV) as an adhesive and conducting layer
25天前
已完结
Friction and Abrasion Durability of Polymer Thin Films Sputtered with a Polyimide Target and Adhesion Property to Copper Substrate (Nitrogen Gas Effect)
1个月前
已关闭
Revisiting the Polyethylene Glycol-Chloride Adsorption Structure on Cu Electrode in Sulfuric Acid Solution by Wide-Frequency ATR-SEIRAS
2个月前
已完结
Influence of Additives on Copper Electrodeposition on Physical Vapor Deposited (PVD) Copper Substrates
2个月前
已完结
Additive Behavior during Copper Electrodeposition in Solutions Containing Cl[sup −], PEG, and SPS
2个月前
已完结
A SERS study of the galvanostatic sequence used for the electrochemical deposition of copper from baths employed in the fabrication of interconnects
2个月前
已完结
A SERS study of the galvanostatic sequence used for the electrochemical deposition of copper from baths employed in the fabrication of interconnects
2个月前
已完结
Competitive Adsorption of PEG and SPS on Copper Surface in Acidic Electrolyte Containing Cl−
2个月前
已完结
Electrodeposition of Copper in the SPS-PEG-Cl Additive System: I. Kinetic Measurements: Influence of SPS
2个月前
已完结
Pentaerythritol-Based Compound as a Novel Leveler for Super-Conformal Copper Electroplating
2个月前
已完结
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