Lv3
346 积分 2024-12-24 加入
Recent Advances and Trends in Advanced Packaging
1个月前
已完结
Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs
1个月前
已完结
Electroless silver plating on through-glass via (TGV) as an adhesive and conducting layer
3个月前
已完结
Friction and Abrasion Durability of Polymer Thin Films Sputtered with a Polyimide Target and Adhesion Property to Copper Substrate (Nitrogen Gas Effect)
3个月前
已关闭
Revisiting the Polyethylene Glycol-Chloride Adsorption Structure on Cu Electrode in Sulfuric Acid Solution by Wide-Frequency ATR-SEIRAS
5个月前
已完结
Influence of Additives on Copper Electrodeposition on Physical Vapor Deposited (PVD) Copper Substrates
5个月前
已完结
Additive Behavior during Copper Electrodeposition in Solutions Containing Cl[sup −], PEG, and SPS
5个月前
已完结
A SERS study of the galvanostatic sequence used for the electrochemical deposition of copper from baths employed in the fabrication of interconnects
5个月前
已完结
A SERS study of the galvanostatic sequence used for the electrochemical deposition of copper from baths employed in the fabrication of interconnects
5个月前
已完结
Competitive Adsorption of PEG and SPS on Copper Surface in Acidic Electrolyte Containing Cl−
5个月前
已完结
皖公网安备34019202002308
