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28 积分 2023-10-16 加入
Some theoretical aspects of pulse electrolysis
1小时前
待确认
印制电路板盲孔电镀铜整平剂的合成及其性能
7个月前
已完结
A novel bright additive for copper electroplating: electrochemical and theoretical study
8个月前
已完结
DFT study of interaction of additives with Cu(111) surface relevant to Cu electrodeposition
1年前
已完结
A novel bright additive for copper electroplating: electrochemical and theoretical study
1年前
已完结
Manipulating coordination environment for a high-voltage aqueous copper-chlorine battery
2年前
已完结
Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects
2年前
已完结
Investigation of novel leveler Rhodamine B on copper superconformal electrodeposition of microvias by theoretical and experimental studies
2年前
已完结
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