Lv5
910 积分 2024-10-22 加入
Vertically aligned carbon fibers-penetrated phase change thermal interface materials with high thermal conductivity for chip heat dissipation
2小时前
已完结
An Integrated Liquid Cooling System Based on Galinstan Liquid Metal Droplets
20天前
已完结
Machine learning-assisted smart epitaxy of III–V semiconductors
23天前
已完结
Flow and thermal modeling of liquid metal in expanded microchannel heat sink
23天前
已完结
Liquid metal printing opening the way for energy conservation in semiconductor manufacturing industry
23天前
已完结
Intelligent identification of moving forces based on visual perception
1个月前
已完结
Intelligent identification of moving forces based on visual perception
1个月前
已完结
Performance study of a biomimetic leaf vein microchannel coupled jet impingement system for high-power chip thermal management
1个月前
已完结
Jet-enhanced manifold microchannels for cooling electronics up to a heat flux of 3,000 W cm−2
3个月前
已完结
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