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8 积分 2025-07-07 加入
Alicyclic Polyimide With Multiple Breakdown Self‐Healing Based on Gas‐Condensation Phase Validation for High Temperature Capacitive Energy Storage
4天前
已完结
Pyromellitic diimide-derived quaternary ammonium salts: Synthesis and application as efficient copper electroplating levelers
4天前
已关闭
Mechanistic Analysis of Filling Failures in Conventional Acidic Sulfate Copper Plating at High Current Density
4天前
已完结
Synergistic and competitive adsorption of ethylene trithiocarbonate with Cl−: A novel accelerator for microvia superfilling via copper deposition
4天前
已完结
Synthesis and Evaluation of Novel Nitrogen-Containing Aromatic Heterocyclic Compounds as Levelers for Copper Electroplating
4天前
已完结
2-Mercaptopyridine as a new leveler for bottom-up filling of micro-vias in copper electroplating
13天前
已完结
Unraveling the defect-free blind via filling mechanism in PCBs by a dual-functional monocomponent additive: in situ molecular spectroscopy and DFT validation
14天前
已完结
Chiral Ruthenabicyclic Complexes: Precatalysts for Rapid, Enantioselective, and Wide-Scope Hydrogenation of Ketones
1个月前
已完结
Thermal Conductivity of Polyacrylamide Hydrogel at Nanoscale
3个月前
已完结
Cyclometallated Chiral Ru Complexes with a Single Labile Coordination Site for Asymmetric Reduction of Amino Ketones
9个月前
已完结
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