Lv1
48 积分 2025-12-14 加入
Bismuth-induced microstructural evolution and dissolution during aging: Enhancing mechanical properties, thermal stability, and wettability of Sn-9Zn alloy
3个月前
已完结
CALPHAD-guided alloy design of Sn–In based solder joints with multiphase structure and their mechanical properties
4个月前
已完结
Effect of indium addition on mechanical, thermal, and soldering properties of eutectic Sn–9Zn alloy
4个月前
已完结
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis
5个月前
已完结
Effect of Sb Addition on Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Ball Joints
5个月前
已关闭
Effect of Minor Sb Additions on Thermal Properties, Microstructure and Microhardness of Sn–Ag–Cu High-Temperature Solder Alloys
5个月前
已完结
Experimental measurements of the shear force on surface mount components simulating the wave soldering process
7个月前
已完结
Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging
8个月前
已完结
皖公网安备34019202002308
