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26 积分 2025-11-11 加入
A novel microchannel-twisted pinfin hybrid heat sink for hotspot mitigation
3个月前
已完结
Heat dissipation and fluid flow in micro-channel heat sink equipped with semi-elliptical pin-fin structures: A numerical study
3个月前
已关闭
Thermal–Mechanical and Signal Reliability of a New Differentiated TSV
3个月前
已完结
An effective method of reducing TSV thermal stress by STI
3个月前
已完结
Fabrication and stress analysis of annular-trench-isolated TSV
3个月前
已完结
Reliability analysis of TSV silicon perforated structures under thermal cyclic loading
3个月前
已完结
A novel coaxial open annular TSV pin-fin embedded in microchannels to comprehensively improve the thermal stability, signal integrity, and heat transfer of 3D integrated circuits
3个月前
已关闭
A high heat transfer performance of inclined rib mini-channel heat sink designed by machine learning and laser powder bed fusion
3个月前
已完结
Toward TSV-Compatible Microfluidic Cooling for 3D ICs
5个月前
已完结
Microfluidic Interposer for High Performance Fluidic Chip Cooling
5个月前
已完结
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