Lv11
38 积分 2025-11-11 加入
Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC
3小时前
已完结
Coupling management optimization of temperature and thermal stress inside 3D-IC with multi-cores and various power density
4天前
已完结
A novel thermal management scheme for 3D-IC chips with multi-cores and high power density
4天前
已完结
Multi-objective topology optimization of through-silicon-via (TSV)-embedded microchannel heat sinks for integrated chip thermal management
6天前
已完结
Multiobjective Optimization for Heat Transfer Performance of Micro-Fins and Signal Integrity of Key Interconnect Technologies in 3-D Integrated Chips
6天前
已完结
TSV-integrated thermoelectric cooling by holey silicon for hot spot thermal management
6天前
已完结
Stored energy density solution for TSV-Cu structure deformation under thermal cyclic loading based on PINN
19天前
已完结
Brief overview of the impact of thermal stress on the reliability of through silicon via: Analysis, characterization, and enhancement
19天前
已完结
Stress-strain analysis and optimization of TSV interconnect structure parameters under thermal cyclic load loading based on bp neural network
20天前
已完结
Dimension Influence on the Interface Fatigue Characteristics of Three-Dimensional TSV Array: A Fully Coupled Thermal-Electrical-Structural Analysis
26天前
已完结
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