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74 积分 2025-09-18 加入
Fabrication of high-performance flexible Ag/Ag 2 Se composite films for thermoelectric applications
1个月前
已完结
Selective Charge Injection via Topological van der Waals Contacts for Barrier‐Free p ‐Type TMD Transistors
4个月前
已完结
Ultralow Contact Resistance in Two-Dimensional Semiconductor Transistors Approaching the Quantum Limit
4个月前
已完结
The effectiveness of the bonding layer to attain reliable thermoelectric structures
4个月前
已完结
Advancements in diffusion barrier layers based on heterogeneous connection of electrode/thermoelectric materials
4个月前
已完结
A promising Co-P/Ni-P multi-layer barrier layer for Bi2Te3 based thermoelectric device
4个月前
已完结
A promising Co-P/Ni-P multi-layer barrier layer for Bi2Te3 based thermoelectric device
4个月前
已完结
Energy harvesting and active heat dissipation of dispenser-printed thick-film thermoelectric modules
5个月前
已完结
Atomic layer bonding contacts in two-dimensional semiconductors
5个月前
已完结
Electrical contacts to two-dimensional semiconductors
5个月前
已完结
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