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60 积分 2025-06-02 加入
Flip Chip and RDL Design
9天前
已完结
RDL and Flip Chip Design
15天前
已完结
Signal and power integrity design of 2.5D HBM (High bandwidth memory module) on SI interposer
15天前
已完结
Chiplet-Package Co-Design For 2.5D Systems Using Standard ASIC CAD Tools
16天前
已完结
Adaptive Redistribution Layer Routing for Chiplet-Package Co-Design in 2.5D System
16天前
已关闭
Process Integration of Photonic Interposer for Chiplet-based 3D Systems
1个月前
已完结
Interconnect Technology and Design for Gigascale Integration
1个月前
已关闭
Direct-to-Silicon Liquid Cooling Integrated on Cowos® Platform
5个月前
已完结
Integrated Package-to-System Thermal Solution Evolution for High-Performance 2.5D CoWoS-R Advanced Packaging Technology Development
5个月前
已完结
An Energy-efficient Si-integrated Micro-cooler for High Power and Power-density Computing Applications
5个月前
已完结
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