Lv21
110 积分 2025-05-13 加入
Correlation study of self-annealing-induced recrystallization and grain growth mechanism in copper foil
14小时前
已完结
Twin boundary and grain boundary engineering to enhance mechanical strength of nanotwinned Cu
1个月前
已完结
Electrodeposition of Cu nanowires with ultrahigh-density twin boundaries: an electrochemical perspective on nanotwinning†
1个月前
已完结
Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate
1个月前
已完结
Microstructure analysis of 8 μm electrolytic Cu foil in plane view using EBSD and TEM
1个月前
已完结
Bonding mechanism of laser joining of Poly-Ether-Ether-Ketone film which used for 5G antenna substrate to copper foil
3个月前
已完结
Super-nano domains enable strength-conductivity synergy in copper foils
4个月前
已完结
Preparation, micro-structure and characterization of high strength and low profile lithium copper foil with SPS and HP additives
4个月前
已完结
Improvement of performance stability of electrolytic copper foils by bi-component additives
4个月前
已完结
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