Lv2
110 积分 2025-05-13 加入
Twin boundary and grain boundary engineering to enhance mechanical strength of nanotwinned Cu
16小时前
已完结
Electrodeposition of Cu nanowires with ultrahigh-density twin boundaries: an electrochemical perspective on nanotwinning†
19小时前
已完结
Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate
19小时前
已完结
Microstructure analysis of 8 μm electrolytic Cu foil in plane view using EBSD and TEM
11天前
已完结
Bonding mechanism of laser joining of Poly-Ether-Ether-Ketone film which used for 5G antenna substrate to copper foil
1个月前
已完结
Super-nano domains enable strength-conductivity synergy in copper foils
2个月前
已完结
Preparation, micro-structure and characterization of high strength and low profile lithium copper foil with SPS and HP additives
3个月前
已完结
Improvement of performance stability of electrolytic copper foils by bi-component additives
3个月前
已完结
Understanding the Electric Double-Layer Structure, Capacitance, and Charging Dynamics
4个月前
已完结
皖公网安备34019202002308
