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10 积分 2022-12-08 加入
Evaluation of Alternative Materials for System-on-Package (SOP) Substrates
1小时前
待确认
Optimization of Thermomechanical Reliability of Board-Level Flip-Chip Packages Implemented With Organic or Silicon Substrates
2小时前
已完结
Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation
2小时前
已完结
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