Lv3
340 积分 2026-01-26 加入
《A high performance liner for copper damascene interconnects》
9天前
已完结
Structural evolution of amorphous and nanocrystalline TiAl films under helium implantation
3个月前
已完结
Difference Between Atomic Layer Deposition TiAl and Physical Vapor Deposition TiAl in Threshold Voltage Tuning for Metal Gated NMOSFETs
3个月前
已完结
Role of oxygen vacancies in V/sub BF//V/sub t/ stability of pFET metals on HfO/sub 2/
3个月前
已完结
Mobility Enhancement Induced by Oxygen Gettering of TiAl for Metal Gated NMOSFETs
3个月前
已完结
皖公网安备34019202002308
