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22 积分 2025-12-28 加入
Effect of thermally-induced cracks on the mechanical and electrical behaviour of TGVs
21天前
已关闭
Advanced through-glass via (TGV) electro-filling and solder bumping for miniaturized 3D MEMS packaging
21天前
已完结
Electrodeposition of Ni-Fe-based low CTE alloy for void-free through glass via filling to enhance the thermo-mechanical reliability of glass substrate
21天前
已完结
The Interfacial Delamination and Fracture Behavior of Cu-filled Through Glass Vias (TGVs) Interposer Package with Multi-Layer RDLs under Thermo-mechanical Loads
22天前
已完结
Fabrication and analysis of through-glass vias for glass-based electronic packaging using an ultrashort pulsed laser
23天前
已完结
Modeling and Characterization of Annealing Effect on the Cu Protrusion and Thermomechanically Behaviors of Through Glass Via
28天前
已完结
The Mechanical Properties and Microstructural Evolution of Copper Pillar in Through Glass Vias under Different Temperatures
28天前
已完结
Time Delay Implementation in Sensorless Control for Ultra-High-Speed Air Compressor Motor of Fuel-Cell Systems
1个月前
已完结
Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching
1个月前
已完结
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