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98 积分 2024-01-25 加入
Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review
1年前
已完结
Coexistence of Superconductivity and Antiferromagnetism in Topological Magnet MnBi2Te4 Films
1年前
已完结
Effects of indium addition on properties and wettability of Sn–0.7Cu–0.2Ni lead-free solders
1年前
已完结
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder
1年前
已完结
Effects of ZrO2 nanoparticles on the mechanical properties of Sn42Bi58 solder joint
1年前
已完结
Effect of Cu6Sn5 nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3.0Ag0.5Cu solder alloys
1年前
已完结
Epoxy solder paste and its applications
1年前
已关闭
Microstructures and Drop Impact Test of SAC305, Sn58%Bi and Epoxy Sn58%Bi Solder Joint on the OSP Surface Finished PCB Substrate
1年前
已完结
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