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76 积分 2021-12-15 加入
High temperature resistant bonding solutions enabling thin wafer processing (Characterization of polyimide base temporary bonding adhesive for thinned wafer handling)
28天前
已完结
Analyzing the behavior and shear strength of common adhesives used in temporary wafer bonding
2个月前
已完结
Optimization of temporary bonding through high-resolution metrologies to realize ultrathin wafer handling
2个月前
已完结
Development of Polyimide Base Photosensitive Permanent Bonding Adhesive for Middle to Low Temperature Hybrid Bonding Processes
3个月前
已完结
Post-Baking-Induced Self-Locking Interpenetrating Networks Strengthen 3D-Printed Polyimide Architectures With Enhanced Thermal and Mechanical Properties
5个月前
已完结
Laser ablation behavior and mechanism of polyimide by UV irradiation
7个月前
已完结
Adhesion promotion of the polyimide–copper interface using silane‐modified polyvinylimidazoles
8个月前
已完结
Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer
8个月前
已完结
Low-temperature bonding of surface-activated polyimide to Cu Foil in Pt-catalyzed formic acid atmosphere
9个月前
已完结
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