Lv3
340 积分 2021-12-15 加入
Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages
18天前
已完结
Hybrid Bonding Process for Fabricating Micro-LED Based on the Au–In/Nonphotosensitive PI System
28天前
已完结
Polyimide-based Release Material for Rapid and Precise Mass Transfer of Semiconductor Chips
28天前
已完结
Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages
2个月前
已完结
Temporary bonding system with photopolymer release layer for 365nm UV debonding without laser
2个月前
已完结
Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages
2个月前
已完结
High temperature resistant bonding solutions enabling thin wafer processing (Characterization of polyimide base temporary bonding adhesive for thinned wafer handling)
5个月前
已完结
Analyzing the behavior and shear strength of common adhesives used in temporary wafer bonding
6个月前
已完结
Optimization of temporary bonding through high-resolution metrologies to realize ultrathin wafer handling
6个月前
已完结
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