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610 积分 2024-06-07 加入
Advanced polishing, grinding and finishing processes for various manufacturing applications: a review
1小时前
待确认
Measuring Interlayer Shear Stress in Bilayer Graphene
1天前
待确认
Tuning the interlayer microstructure and residual stress of buffer-free direct bonding GaN/Si heterostructures
1天前
待确认
High Thermal Boundary Conductance across Bonded Heterogeneous GaN–SiC Interfaces
1天前
已完结
Cubic GaN/AlN multi‐quantum wells grown on pre‐patterned 3C‐SiC/Si (001)
2天前
已关闭
Large-band-gap SiC, III-V nitride, and II-VI ZnSe-based semiconductor device technologies
1个月前
已完结
Atomistic modeling of thermo‐mechanical properties of cubic SiC
1个月前
已完结
Metric for quantifying elastic and inelastic thermal transport at interfaces
1个月前
已完结
Full quantification of frequency-dependent interfacial thermal conductance contributed by two- and three-phonon scattering processes from nonequilibrium molecular dynamics simulations
1个月前
已关闭
Force and heat current formulas for many-body potentials in molecular dynamics simulations with applications to thermal conductivity calculations
1个月前
已完结
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