Lv4
420 积分 2024-06-07 加入
Direct Wafer Bonding of Silicon Carbide and Copper
15小时前
待确认
Probing and tuning inelastic phonon conductance across finite-thickness interface
17天前
已完结
Molecular Dynamics Simulation on In-Plane Thermal Conductivity of Graphene/Hexagonal Boron Nitride van der Waals Heterostructures
27天前
已完结
The Role of Amorphous Nanocrystalline Carbon Films in Interference on Flexible Copper Foils
27天前
已完结
Nano-Sized Copper Films Prepared by Magnetron Sputtering
28天前
已完结
Improved wavelength stability and heat dissipation of InGaN-based light-emitting diodes using a graphene interlayer on patterned sapphire substrate
29天前
已完结
Density and atomic coordination dictate vibrational characteristics and thermal conductivity of amorphous silicon carbide
1个月前
已完结
Quantized thermal transport across contacts of rough surfaces
1个月前
已完结
Interfacial Thermal Conductance and Thermal Rectification of Hexagonal BCnN/Graphene In-Plane Heterojunctions
1个月前
已完结
Topological Defects at the Graphene/h-BN interface Abnormally Enhance Its Thermal Conductance
1个月前
已完结
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